This standard lays out the general requirements for designing printed circuit boards and various component mounting or interconnecting structures. The materials used can be homogeneous, reinforced, or combined with inorganic materials, and the interconnections can be single, double, or multi-layered.

The requirements in this standard are intended to establish design principles and recommendations to be used alongside specific interconnecting structure sectional standards. These principles will help create detailed designs for mounting and attaching passive and active components. It’s important to note that this standard is not meant to be used as a performance specification for finished boards or as an acceptance document for electronic assemblies.

For acceptability requirements of electronic assemblies, you can refer to IPC/EIA-J-STD-001 and IPC-A-610. Also liaise with PCB layout consultants to ensure your adhere to recognised standards.

The components used in the designs can be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting, or unpackaged bare die. As for the materials, they can be any combination that fulfills the physical, thermal, environmental, and electronic functions required.”

This standard aims to provide helpful information about the general requirements for designing organic printed boards. It covers all aspects and details of the design, catering to a wide range of designs that use organic materials, as well as combinations with inorganic materials like metal, glass, and ceramic. These boards are essential for mounting and connecting electronic, electromechanical, and mechanical components.

When working on a project, it’s important to decide on the product type as early as possible. Once you’ve chosen the component mounting and interconnecting technology, make sure to obtain the specific document focused on that technology.

Consider exploring different printed board construction options for your product. For example, using a rigid-flex printed wiring board might be more cost-effective and perform better than using multiple printed wiring boards, connectors, and cables.

IPC’s documentation strategy involves providing distinct documents that focus on specific aspects of electronic packaging. Each document set is identified by a four-digit number ending in zero (0).

The first document in the set contains generic information and is identified by the four-digit set number. It is complemented by one or more sectional documents, each providing specific focus on a particular aspect of the topic or selected technology. At the minimum, you’ll need the generic design document, the sectional document for the chosen technology, and the engineering description of the final product.

As technology evolves, specific focus standards will be updated, and new focus standards may be added to the document set. We welcome your input and encourage you to share your thoughts through our ‘Suggestions for Improvement’ forms located at the end of each document.”