In conjunction with IPC-2221, IPC-2222 defines the specific requirements for designing Rigid Organic Printed Boards and other types of component mounting and interconnecting structures.

This standard is applicable to single-sided, double-sided, or multi-layered boards, and it covers several key concepts and design requirements:

1. Rigid laminate properties: Ensuring the right properties for the rigid material used in the board.
2. Printed board assembly: Guidelines for assembling the printed boards with components.
3. Holes / interconnections: Requirements for holes and interconnections on the board.
4. Dielectric spacing: Specifying the spacing between conductive layers to avoid interference.
5. Lead-free laminate materials: Recommendations for using environmentally friendly laminate materials.
6. Scoring & routing parameters: Guidelines for scoring and routing the board to create the desired shapes.
7. Printed board thickness tolerance: Defining the acceptable variations in board thickness.
8. Non-functional lands: Ensuring proper design and usage of non-functional areas on the board.
9. Hole aspect ratios: Requirements for the ratio between hole diameter and thickness.
10. Clearance areas in planes: Specifying clearance areas in the conductive planes of the board to avoid interference.

By following IPC-2222 along with IPC-2221, you can achieve well-designed Rigid Organic Printed Boards and efficient component mounting and interconnections.”